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For software with demanding computer graphics needs, custom-engineered hardware platforms that take advantage of these technologies are yielding significant performance gains.  

 

The newest CPU and flash memory chipsets are making a dramatic difference in the performance of compute-intensive applications such as simulation, modeling and entertainment.

Intrigued by what you’ve heard and wonder what these could do for your application’s performance? We’ll give you the lowdown!

Faster compute, faster read/write, faster storage, and more

Compute-intensive workloads like modeling and simulation applications see many benefits from pairing the new Intel architecture with the latest flash storage technology.

The most impactful benefits are faster compute, up to four onboard 10GbE networking ports, and the inclusion of on-board NVMe support (Non-Volatile Memory Express), a new connectivity standard giving much faster speeds on low latency flash storage. These capabilities stem from features of the Intel® Scalable Xeon® Processor platform such as increases in memory speed, CPU cores, and the number of channels of DDR4 and PCIe lanes per CPU.

The use of 3D NAND flash memory triples the storage capacity per memory chip, shrinking SSD size and lowering the cost per gigabyte while also providing higher data write performance.

The higher density achieved through the combination of the new Intel platform and 3D NAND technology also helps shrink system footprint and associated power needs by slashing the number of physical disks required to reach the target performance level. For example, a system with a target IOPS of 1000 would require 8 10K HDDs in a RAID 5 configuration for redundancy and fault tolerance, not including RAID overhead. MBX can now build the same system with just two NVMe SSD disks in a simpler and less space-intensive RAID 1 configuration that can support no more than two disks.

With the ability to drive faster graphics and video, store more data in less space, and take advantage of the declining costs of flash storage, now is an ideal time to work with the MBX engineering team to upgrade your platform configuration.

Attending I/ITSEC 2017 next week?

Stop by MBX booth #1513 at the I/ITSEC (Interservice/Industry Training, Simulation and Education) conference in Orlando to discuss your next-generation appliance platform, and turbocharge performance improvements using Intel Scalable Xeon Processors and 3D NAND flash storage.